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Ceramic heating elements

made of hotpressed silicon nitride ceramic


Wafer heaters

made of silicon nitride ceramic

Products / Ceramic heating elements / Wafer heaters

Wafer heaters


Description

Ceramic hot plates made of silicon nitride can be produced with an outer diameter of 400 mm. Within this diameter any rectangular shapes, customized shapes and openings are possible. A typical height of the plates is 5 mm and with an integrated cooling channel about 15 mm. The special properties and low mass of the ceramic material allow fast heating rates, uniform temperature distribution and outstanding precision in control. In comparison to metal the surface of ceramic stays flat due to its low thermal expansion even when operated with fast changes in temperature. The high strength of hot-pressed silicon nitride guarantees high stress resistance (e. g. with high pressure loads) and excellent wear resistance. The hot plates are very suitable for demanding processes in semiconductor processing systems.


Customized design

Our in-house designs make any modification in size, configuration, or performance simple and convenient. Mounting-bracket holes and bores for temperature sensors can be added to the design. Laser-cut vacuum grooves can be added as well. Our hot plates come already flat ground, however they can be ground further up to a flatness of < 10 μm to meet specific requirements. Furthermore, our ceramic heating conductor with its customized design allows the integration of several heating zones. Devices to compensate for heat loss and an internal test lead for temperature measurement can be easily built in. For operating in high vacuum at up to 1 000 °C a pin contact can be supplied. In several customer projects we integrated a cooling function which can be produced by a cooling module with integrated channels. This cooling module is brazed high vacuum tight to the heater. Cooling is effected by compressed air or nitrogen.


Range of products

This is only a small selection from our product portfolio. For other variants please contact us with our product request form.

Dimensions Heated area Tmax Remark
90 x 90 x 6.0 mm 90 x 90 x 6.0 mm 500 °C -
Ø 150 x 7.0 mm Ø 150 x 7.0 mm 500 °C -
Ø 300 x 8.0 mm Ø 300 x 8.0 mm 500 °C two heating circuits

Advantages

Your advantages:

  • You have superior temperature uniformity and flatness of the hotplate
  • Integrated active cooling and vacuum chucking upon request
  • The heating and cooling function can be adapted to your process requirements

Areas of application

  • semiconductor processing systems (e. g. die bonders)
  • coating systems (CVD, PVD)
  • soldering systems
  • vacuum technology
  • annealing / etching processes
  • lithography